#Toshiba introduced the world to third-generation #3Dflash using #Toggle2 today at Dell World. At the Toshiba booth, you can see firsthand a notebook running #BiCSFLASH--which is Toshiba's name for #3DNAND technology that now sports 64 layers and a massive density that puts a full terabyte of storage into a single die stack. We first tested BiCS FLASH in our initial DRAMless SSD Roundup and believe it's the only third-party test using the technology. The reference design prototype from Phison used second-generation BiCS. That product eventually shipped in a limited number of products, including some Apple iPhones and a Toshiba BGA single package SSD using package on package (PoP) technology for an OEM customer.
http://www.tomshardware.com/news/toshiba-third-gen-bics-flash-dell-world,34354.html
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