Intel CEO Brian Krzanich announced during the company's Q4 2016 earnings call that Intel is shipping #3DXPoint memory DIMMs to data center customers. Most new bleeding-edge technology spends its infancy in the data center and then trickles down to the consumer market--and 3D XPoint DIMMs will not be an exception. 3D XPoint's incredible performance and endurance characteristics should redefine our expectations for storage devices, but the true promise of the new technology lies in memory usage models. 3D XPoint is fast enough to use as a slower tier of memory that will slot in between DRAM and NAND.
http://www.tomshardware.com/news/intel-3d-xpoint-dimms-shipping,33539.html
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